Congatec conga-TCA 047001 Guide de l'utilisateur télécharger pdf (Page 20)

3 Heatspreader

An important factor for each system integration is the thermal design. The heatspreader acts as a thermal coupling device to the module and

its aluminum plate is 4mm thick.

The heatspreader is thermally coupled to the CPU via a thermal gap ller and on some modules it may also be thermally coupled to other heat

generating components with the use of additional thermal gap llers.

Although the heatspreader is the thermal interface where most of the heat generated by the module is dissipated, it is not to be considered as a

heatsink. It has been designed as a thermal interface between the module and the application specic thermal solution. The application specic

thermal solution may use heatsinks with fans, and/or heat pipes, which can be attached to the heatspreader. Some thermal solutions may also

require that the heatspreader is attached directly to the systems chassis thereby using the whole chassis as a heat dissipater.

For additional information about the conga-TCA heatspreader, refer to section 3.1 of this document.

Caution

There are mounting holes on the heatspreader designed to attach the heatspreader to the module. These mounting holes must be used to

ensure that all components that are required to make contact with heatspreader do so. Failure to utilize these mounting holes will result in

improper contact between these components and heatspreader thereby reducing heat dissipation efciency.

Attention must be given to the mounting solution used to mount the heatspreader and module into the system chassis. Do not use a threaded

heatspreader together with threaded carrier board standoffs. The combination of the two threads may be staggered, which could lead to

stripping or cross-threading of the threads in either the standoffs of the heatspreader or carrier board.

Caution

When using PN: 047003 conga-TCA/D2550 and/or PN: 047004 conga-TCA/D2550 xHCI modules in conjunction with the conga-TCA/CSP-T(B)

passive cooling solution, active airow must be provided over the cooling ns. The conga-TCA/CSP-T(B) is not capable of dissipating the heat

generated by these modules without an active airow present.

1 2 ... 15 16 17 18 19 20 21 22 23 24 25 ... 93 94

Pas de commentaire

Congatec conga-TCA 047001 Guide de l'utilisateur Page 20